Evaporator for use in a heat transfer system

Details Evaporator for use in a heat transfer system Evaporator for use in a heat transfer system

2005-10-25

2010-12-07

Campbell, Thor S (Department: 3742)

Electric resistance heating devices

Heating devices

With heat storage means

C392S386000, C392S395000

Reexamination Certificate

active

07848624

ABSTRACT:
An evaporator includes a liquid barrier wall made of a ceramic material, a vapor barrier wall made of a ceramic material, and a wick made of a ceramic material and being positioned between the liquid barrier wall and the vapor barrier wall.

REFERENCES:
patent: 3196634 (1965-07-01), Rich
patent: 3598180 (1971-08-01), Moore, Jr.
patent: 3661202 (1972-05-01), Moore, Jr.
patent: 3741289 (1973-06-01), Moore
patent: 3901311 (1975-08-01), Kosson et al.
patent: 4274479 (1981-06-01), Eastman
patent: 4765396 (1988-08-01), Seidenberg
patent: 4815528 (1989-03-01), Shaubach et al.
patent: 4883116 (1989-11-01), Seidenberg et al.
patent: 4934160 (1990-06-01), Mueller
patent: 5152959 (1992-10-01), Scorey
patent: 5303768 (1994-04-01), Alario et al.
patent: 5587228 (1996-12-01), Baker et al.
patent: 5692095 (1997-11-01), Young
patent: 5870525 (1999-02-01), Young
patent: 6162046 (2000-12-01), Young et al.
patent: 6241008 (2001-06-01), Dunbar
patent: 6347936 (2002-02-01), Young et al.
patent: 6382309 (2002-05-01), Kroliczek et al.
patent: 6585509 (2003-07-01), Young et al.
patent: 6634864 (2003-10-01), Young et al.
patent: 6668912 (2003-12-01), Adams et al.
patent: 6768751 (2004-07-01), Hoar
patent: 6863117 (2005-03-01), Valenzuela
patent: 6880625 (2005-04-01), Choi et al.
patent: 6892799 (2005-05-01), Maydanik et al.
patent: 7028759 (2006-04-01), Rosenfeld et al.
patent: 7191820 (2007-03-01), Chou et al.
patent: 2004/0151598 (2004-08-01), Young et al.
patent: 2007/0284088 (2007-12-01), Chun
patent: 2008/0283223 (2008-11-01), Chang et al.
Mark A. Occhionero, et al., “Aluminum Silicon Carbide (AISiC) Thermal Management Packaging for High Density Packaging Applications,” IMAPS HDP and MCM's, Denver, CO, Apr. 6-9, 1999 (6 total pages).
Ceramic Assembly, Corwil Technology Corporation [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.corwil.com/ceramic/packages.html (2 toal pages).
Configuration of Hermetic Packages, National Semiconductor [online], [last modified Nov. 2002]. Retrieved from the Internet: http://www.national.com/quality/files/Package—Configuration—Hermetic.pdf (4 total pages).
Hybrid Ceramic substrates, CoorsTek Amazing Solutions® [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.coorstek.com/electronics/ceramicsubstrates.asp (3 total pages).
About KAI, Kyocera [online], [Jan. 14, 2000]. Retrieved from the Internet: http://americas.kyocera.com/kai/semiparts/about/displaypress.cfm?key=71 (2 total pages).
CFV Theory and Practice, Vapore, Inc. [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.vaporeinc.com/cfvtheory.html (2 total pages).
How it Works, Vapore, Inc. [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.vaporeinc.com/cfvtechnology.html (3 total pages).
Copper Tungsten (Cu-W), Sumitomo Electric U.S.A., Inc. [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.sumitomoelectricusa.com/scripts/products/ts/hs—matl.cfm (1 page).
Bonded Fin Heat Sinks, Enertron [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.enertron-inc.com/BondedFinHeatSink.html (2 total pages).
Heat Sinks—Laminated Sheets—Copper Composites—MarkeTech International Inc. [online], [prior to Oct. 25, 2004]. Retrieved from the Internet: http://www.mkt-intl.com/tungsten/wcu.html (2 total pages).
Mark A. Occhionero et al., Aluminum Silicon Carbide (AISiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions, presented at the 2000 HDI Conference in Denver, Colorado, Apr. 26-28 (5 total pages).
Mark A. Occhionero et al., Aluminum Silicon Carbide (AISiC) for Cost-Effective Thermal Management and Functional Microelectronic Packaging Design Solutions, 12thEuropean Microelectronics and Packaging Conference, Jun. 7-9, 1999 (8 total pages).
M.A. Occhionero et al., Aluminum Silicon Carbide (AISiC) Waveguide Substrate for Commercial Communications Application: A Case Study, proceedings of the 26thAnnual IMAPS NE Symposium, Andover, MA (May 1999) (20 total pages).
M.A. Occhionero et al., Cost-Effective Manufacturing of Aluminum Silicon Carbide (AISiC) Electronic Packages, proceedings of the IMAPS Advanced Packaging Materials Symposium, (Braselton, GA, Mar. 14-17, 1999) (7 total pages).
M.A. Occhionero et al., A New Substrate for Electronic Packaging: Aluminum-Silicon Carbide (AISiC) Composites, proceedings of the 4thAnnual Portable by Design Conference, Electronics Design, Mar. 24-27 (6 total pages).

Affiliated with

Also associated with

Rating

Evaporator for use in a heat transfer system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Evaporator for use in a heat transfer system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Evaporator for use in a heat transfer system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4213657