Evaporative cooling vessel for controlling the temperature of a

Details Evaporative cooling vessel for controlling the temperature of a Evaporative cooling vessel for controlling the temperature of a

1996-07-01

1999-01-19

Ramsey, Kenneth J.

Metal fusion bonding

With means to cool work or product

B23K 308

Patent

active

058605835

ABSTRACT:
An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.

REFERENCES:
patent: 3430686 (1969-03-01), Parkinson et al.
patent: 3616533 (1971-11-01), Heap et al.
patent: 5230462 (1993-07-01), Vascak et al.
Electronic Design, "Wet Felt Sinks Heat," p. 103, Apr. 1, 1959.

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