Evaporation cooling module for semiconductor devices

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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16510433, H02B 100, H05K 720

Patent

active

047046589

ABSTRACT:
An evaporation cooling module for cooling plural semiconductor chips bonded on circuit boards immersed in a coolant within the module employs immersed heat exchangers associated with bubble traps which trap gaseous bubbles of evaporated coolant and maintain same in contact with the heat exchanger for improved reliquification efficiency. Bubble guides, which may be mounted to the circuit boards intermediate vertically spaced rows of semiconductor chips, guide gaseous bubbles of the evaporated coolant to the bubble trap, producing local convection coolant currents affording increased reliquification efficiency by released gases and improved temperature uniformity of the plural semiconductor chips. Use of immersed heat exchangers avoids decrease in reliquification efficiency since isolated therefrom. Bubble traps of predetermined porosity permit preferential separation of gaseous bubbles of the evaporated coolant and the undesired released gases.

REFERENCES:
patent: 3270250 (1966-08-01), Davis
patent: 3489207 (1970-01-01), Miller
patent: 3512582 (1970-05-01), Chu et al.
patent: 4572286 (1986-02-01), Fujii et al.
patent: 4619316 (1986-10-01), Nakayama et al.

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