Evaporation apparatus comprising film substrate voltage applying

Details Evaporation apparatus comprising film substrate voltage applying Evaporation apparatus comprising film substrate voltage applying

1992-02-07

1993-11-02

Hearn, Brian E.

Coating apparatus

Gas or vapor deposition

Running length work

118715, 118723R, 118724, 20429805, C23C 1424

Patent

active

052580741

ABSTRACT:
An evaporation apparatus includes a vacuum chamber, a vacuum pump for producing a pressure-reduced atmosphere in the vacuum chamber, at least one vacuum evaporation device for evaporating an evaporation material provided in the vacuum chamber, a drum opposed to the vacuum evaporation device and rotating, for cooling a film substrate on which the evaporation material is to be deposited, a supply roller for supplying the film substrate to the drum, a winding roller for winding the film substrate on which the evaporation material has been deposited, a free roller for assisting the winding and travel of the film substrate, a voltage applying device for applying a DC voltage to the film substrate on which the evaporation material has been deposited; and an electric current measuring device for measuring an intensity of electric current flowing between the film substrate on which the evaporation material has been deposited and the ground.

REFERENCES:
patent: 4511594 (1985-04-01), Yanai et al.
patent: 4579639 (1986-04-01), Enomoto et al.
patent: 5180433 (1993-01-01), Okuda et al.
Schiller et al, "Vacuum Evaporation", Mar. 1978 (translated portions).
Stanley Wolf, Silicon Processing for the VLSI Era, 1986, pp. 377-379.

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