Evanescent III-V silicon photonics device with spin coat...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S129000, C385S131000, C385S030000

Reexamination Certificate

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07734123

ABSTRACT:
Briefly, in accordance with one or more embodiments, a hybrid photonics device comprises a silicon portion having one or more features formed therein, a non-silicon portion comprising one or more photonics devices proximate to the one or more features of the silicon portion, and a bonding layer coupling the silicon portion with the non-silicon portion, the non-silicon portion being bonded to the silicon portion via the bonding layer prior to patterning of the one or more photonics devices.

REFERENCES:
patent: 6852556 (2005-02-01), Yap
patent: 2007/0170417 (2007-07-01), Bowers
Alexe, M., V. Dragoi, M. Reiche, U. Gosele, “Low temperature GaAs/Si direct wafer bonding”, Electronics Letters, V. 36, 667-8 (2000).
“An electrically pumped hybrid silicon evanescent amplifier,” H. Park, A. W. Fang, R. Jones, O. Cohen, J. E. Bowers, Optical Fiber Communication Conference (OFC 2007), OTuD2, Anaheim CA, Mar. 2007.
W.P. Wong, K.S. Chiang, “Calculation of Confinement Factors for Multiple-Quantum-Well Optical Amplifiers by the Effective—index Model”, Microwave and optical Technology Letters, vol. 25, No. 4, May 2000, 275-8.

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