Evaluation of the quality of wiring formed in a test semiconduct

Details Evaluation of the quality of wiring formed in a test semiconduct Evaluation of the quality of wiring formed in a test semiconduct

1996-10-09

1999-03-02

Ballato, Josie A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

For fault location

324534, 324535, G01R 3111

Patent

active

058776311

ABSTRACT:
An evaluation method for a test semiconductor device having at least two wiring patterns disposed in parallel, wherein: at least one wiring pattern is grounded; a pulse voltage is applied between the grounded wiring pattern and an adjacent wiring pattern; a time required for the pulse to reciprocate along the wiring patterns and a value of a voltage including a reflected voltage between the wiring patterns are measured to judge a presence/absence of a wiring breakage or a wiring short circuit and to locate a wiring breakage point or a wiring short circuit point.

REFERENCES:
patent: 3434049 (1969-03-01), Frye
patent: 4791351 (1988-12-01), Le Traon et al.
patent: 5498965 (1996-03-01), Mellitz
patent: 5648724 (1997-07-01), Yankielun et al.

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