Evaluation method

Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed

Reexamination Certificate

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Reexamination Certificate

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06960481

ABSTRACT:
A high-reliability evaluation technique is proposed which is related to semiconductor device manufacture. A photoresist formed on a wafer is subjected to exposure and development thereby to form a pair of opposed patterns (1, 2) with distance x in the photoresist, followed by measurement of distance x between the patterns (1, 2) in the photoresist. For example, the amount of variations in exposure energy is evaluated by using the measuring result. The evaluation is made by using distance x between patterns (1, 2) which are easy to change with variations in exposure energy, etc., thus improving the reliability of evaluation.

REFERENCES:
patent: 5805290 (1998-09-01), Ausschnitt et al.
patent: 6174741 (2001-01-01), Hansch et al.
patent: 7-74074 (1995-03-01), None
patent: 172801 (1998-03-01), None
D. Wheeler, et al, “Phase Shift Focus Monitor Applications to Lithography Tool Control”, 1997, SPIE, vol. 3051, pp. 225-233.

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