Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1977-08-26
1980-01-01
Husar, Francis S.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
228123, 228124, 29574, 29590, H01L 2500
Patent
active
041812492
ABSTRACT:
A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is, silicon is either evaporated or deposited onto the backside of a sapphire or silicon-on-sapphire wafer. After the wafer has been scribed into die, the die are attached to the gold pads in the ceramic package using a gold-silicon preform as an intermediate layer.
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Hawkins Dennis H.
Peterson Henry T.
Hughes Aircraft Company
Husar Francis S.
MacAllister W. H.
Ramsey K. J.
Sternfels Lewis B.
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