Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1991-05-14
1992-04-28
Seidel, Richard K.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
22826312, 228198, B23K 3102, B23K 3536
Patent
active
051080265
ABSTRACT:
An improved eutectic oxide bonding method is applied for bonding a metallic copper foil to a nonmetallic substrate by forming a liquid phase derived from a eutectic oxide composition. A metallic copper thin film is initially deposited onto the substrate and heated in a low oxygen atmosphere under suitable conditions to form a cuprous oxide film. A metallic copper foil is positioned on the substrate in contact with the cuprous oxide film. Preferably, the assembly is initially heated at a temperature below the eutectic melting point to soften the foil and promote intimate contact between the foil and the cuprous oxide film. Thereafter, the assembly is heated above the eutectic melting point to form a liquid phase at the interface of the foil and the cuprous oxide film, and maintained at the temperature for a time sufficient to dissolve the oxide film, whereupon the liquid phase wets the substrate. The assembly is cooled, and the liquid phase is solidified to bond the foil to the substrate. In addition to copper, the method may be adopted to bond foils of other metals, including chromium, iron, cobalt and nickel, using low melting eutectic oxides thereof.
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Somers John W.
Su Ming-Yih
Fekete Douglas D.
Knapp Jeffrey T.
Motorola Inc.
Seidel Richard K.
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