Coating processes – Electrical product produced – Metal coating
Patent
1989-12-06
1994-11-29
Nelson, Peter A.
Coating processes
Electrical product produced
Metal coating
4271265, 427250, 148 333, 29897, B05D 512, C23C 1600
Patent
active
053688805
ABSTRACT:
A method of forming a eutectic bond, of Cadmium Telluride to Sapphire utilizing the Gold/Silicon eutectic bonding of the Cadmium Telluride to the Sapphire. A multi-layer structure of: Chromium which provides adhesion to the Cadmium Telluride; a Titanium layer which functions as a diffusion barrier to the Gold, and a Gold layer are sequentially evaporated on the Cadmium Telluride; a separate multilayered structure of: Silicon grown on Sapphire, and Gold evaporated upon the Silicon. These two multilayered structures are then eutectically bonded. This method enables the expansion coefficient of the eutectic layer to be tailored through the Gold concentration to match that of the Cadmium Telluride. This method also allows the bonding stress to be confined between the Gold/Silicon eutectic and the Sapphire substrate, eliminating the bonding stress in the Cadmium Telluride. Also, due to the precision of the thickness of the evaporated layers, the bonded substrates are inherently planar and parallel.
REFERENCES:
patent: 3495322 (1970-02-01), Goldstein
patent: 3711325 (1973-01-01), Hentzschel
patent: 3992774 (1976-11-01), Burrer et al.
patent: 4078711 (1978-03-01), Bell
patent: 4089991 (1978-05-01), Robillard
patent: 4104789 (1978-08-01), Robillard
patent: 4181299 (1980-01-01), Peterson et al.
patent: 4574470 (1986-03-01), Burt
patent: 4576851 (1986-03-01), Iwamatsu
patent: 4655848 (1987-04-01), Kay et al.
patent: 4743310 (1968-05-01), Kay et al.
patent: 4771018 (1988-09-01), Bhattacharyya et al.
patent: 4963509 (1990-10-01), Yoshizawa et al.
Baumler Sandra L.
McKee Richard C.
Schimert Thomas R.
Nelson Peter A.
Westinghouse Electric Corporation
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