Etching tri-metal layers to form electronic circuits using aqueo

Details Etching tri-metal layers to form electronic circuits using aqueo Etching tri-metal layers to form electronic circuits using aqueo

1997-12-22

2000-02-01

Gulakowski, Randy

Compositions

Etching or brightening compositions

Alkali metal hydroxide containing

216102, C09K 1302

Patent

active

060199105

ABSTRACT:
The invention is an aluminum etchant and method for chemically milling aluminum, according to one embodiment, from a copper-aluminum-copper tri-metal layer to form electronic circuits. The tri-metal comprises copper circuit patterns present on opposing surfaces of an aluminum foil, one of the copper patterns being laminated on a substrate. The etchant comprises an aqueous solution of 50 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and 60 to 500 g/l nitrate salt. The method comprises contacting the tri-metal with the etchant at a temperature between 25 and 95.degree. C. for a time sufficient to remove a desired amount of the aluminum layer and provide electronic circuitry (rigid/flexible/3-dimensional circuitry) which contains multiple conductive circuit layers.

REFERENCES:
patent: 3957553 (1976-05-01), Smith
patent: 4349411 (1982-09-01), Okinaka
patent: 4417949 (1983-11-01), Lindner et al.
patent: 4588474 (1986-05-01), Gross
patent: 5091046 (1992-02-01), Hohn

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