Etching tool

Details Etching tool Etching tool

1993-11-16

1995-07-04

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 54, C23F 102

Patent

active

054297044

ABSTRACT:
A tool for etching at least one selected area of a silicon dixoide layer on a wafer. The tool includes a container which is partially filled with hydrofluoric (HF) acid. The tool further includes a template having an aperture extending between each selected area and the container. Vapors of the HF acid pass through each aperture to contact and etch each selected area in order to expose a test die on the wafer. An O-ring is associated with each selected area for sealing each of the selected areas from the remaining areas on the silicon dioxide layer such that substantially only the selected areas are etched by the vapors.

REFERENCES:
patent: 5173152 (1992-12-01), Tanaka
patent: 5174855 (1992-12-01), Tanaka
patent: 5256594 (1993-10-01), Wu

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