Etching solution for multiple layer of copper and molybdenum...

Compositions – Etching or brightening compositions

Reexamination Certificate

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C438S689000, C216S096000, C216S097000

Reexamination Certificate

active

07416681

ABSTRACT:
An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.

REFERENCES:
patent: 2001/0008828 (2001-07-01), Uchikura et al.

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