Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2005-01-11
2005-01-11
Mills, Gregory (Department: 1763)
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
Reexamination Certificate
active
06841084
ABSTRACT:
A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.
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Lillie Dan
Wang Jiangtao
Culbert Roberts
Kusner & Jaffe
Mills Gregory
Nikko Materials USA, Inc.
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