Etching process for accurately making small holes in thick mater

Details Etching process for accurately making small holes in thick mater Etching process for accurately making small holes in thick mater

1974-07-11

1976-07-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 16, 156345, C23F 102

Patent

active

039716821

ABSTRACT:
A sheet of metallic material having a thickness T is covered on one side by an etchant resist and on the opposite side by an etchant resist and a removable shield. Etching is first performed on the side with only the etchant resist layer. Next, the shield is removed and the material is etched from both sides to produce an opening having a minimum dimension less than the thickness T of the material.

REFERENCES:
patent: 2536383 (1951-01-01), Mears et al.
patent: 2750524 (1956-06-01), Braham
patent: 3415699 (1968-12-01), Brown
patent: 3679500 (1972-07-01), Kubo et al.

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