Etching a substrate: processes – Nongaseous phase etching of substrate
Reexamination Certificate
2001-10-15
2008-10-07
Ahmed, Shamim (Department: 1792)
Etching a substrate: processes
Nongaseous phase etching of substrate
C216S017000, C216S018000, C216S041000, C438S745000, C438S749000, C134S002000, C134S003000, C134S026000
Reexamination Certificate
active
07431860
ABSTRACT:
A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the material. Droplets may be deposited from a print head of the type having a nozzle from which the material may be ejected as a series of droplets, such as an ink jet print head. In a preferred application, a series of ridges can be etched from an organic insulator layer overlying a photoemissive organic polymer. A conductive layer is then deposited and the ridges of organic insulator are dissolved by solvent washing to provide an array of conductive stripes which can be used as a cathode for an electroluminescent display device. In combination, both anode and cathode can be fabricated for a display device without the need for photolithography, which is particularly advantageous for the fabrication of large area display devices.
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Ahmed Shamim
Oliff & Berridg,e PLC
Seiko Epson Corporation
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