Etching or coating method and a plant therefor

Details Etching or coating method and a plant therefor Etching or coating method and a plant therefor

1994-05-27

1995-10-24

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429806, 20429811, 20429815, 20429831, 156345, C23C 1434, B44C 122

Patent

active

054607078

ABSTRACT:
An etching or coating plant has a vacuum recipient and a pair of electrodes located at a distance from each other and adapted to produce a capacitive plasma discharge in the recipient. The wall structure encasing the recipient is divided into two parts which are insulated from each other and which both serve for the electric signal transmission to their surfaces located at the inside and acting as electrode surfaces whereby by means of the division of the wall structure of the recipient it will be controlled which of the electrodes is eroded and which one is coated, respectively. Disclosed is further a method of igniting plasma discharges and the intermittent operation thereof.

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