Etching operation management systems and methods

Details Etching operation management systems and methods Etching operation management systems and methods

2007-07-10

2007-07-10

Bahta, Kidest (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S097000, C700S095000, C438S014000

Reexamination Certificate

active

11073979

ABSTRACT:
Systems and methods for etching operation management. A process controller acquires a line width on a processed wafer, determines a first Critical Dimension (CD) bias by subtracting the measured width from a target width, determines an adjusted target width by providing a first and a second etching duration, determines a second CD bias by providing the adjusted target width, determines third etching duration corresponding to the second CD bias, receives an event from an etching tool, and directs the etching tool to perform etching operations on an initiated wafer for the third etching duration.

REFERENCES:
patent: 5926690 (1999-07-01), Toprac et al.
patent: 6368879 (2002-04-01), Toprac
patent: 2004/0029299 (2004-02-01), Pasadyn et al.
patent: 2004/0138773 (2004-07-01), Tomoyasu
patent: 2005/0136560 (2005-06-01), Helwig

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