Etching of thin layers of reactive metals

Details Etching of thin layers of reactive metals Etching of thin layers of reactive metals

1975-05-21

1976-11-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 18, 252 793, 252 794, H01L 21441

Patent

active

039922359

ABSTRACT:
Thin films of reactive metals in contact with layers of more noble metals, are etched by an etchant including a reactive cathodic inhibitor. The etchant is a hydrofluroric acid-based composition with hydrogen peroxide, a water soluble tetrazolium compound (the inhibitor) and a surface modifier, such as an alcohol or a more complex surfactant. For exemplary compositions, the undercutting of masking layers of noble metals or photolithographic materials is limited to the same order as the reactive metal film thickness.

REFERENCES:
patent: 2974021 (1961-03-01), Borowik
patent: 3657029 (1972-04-01), Fuller
patent: 3860464 (1975-01-01), Erdman et al.
patent: 3890177 (1975-06-01), Pfahnl et al.

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