Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2007-02-26
2009-02-10
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S459000, C438S931000, C257SE21054, C257SE21245, C257SE21605
Reexamination Certificate
active
07488692
ABSTRACT:
Fabrication of a light emitting device includes etching of a substrate of the light emitting device. The etch may be an aqueous etch sufficient to increase an amount of light extracted through the substrate. The etch may be a direct aqueous etch of a silicon carbide substrate. The etch may remove damage from the substrate that results from other processing of the substrate, such as damage from sawing the substrate. The etch may remove an amorphous region of silicon carbide in the substrate.
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Cree Inc.
Myers Bigel & Sibley & Sajovec
Nhu David
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