Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1972-08-15
1976-03-30
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29580, 156 17, 252 795, 427 88, H01L 750
Patent
active
039473040
ABSTRACT:
Group III-V compound semiconductor devices with attached gold conductor areas are etched using a basic ferricyanide etchant. The etchant is an aqueous solution containing ferricyanide ions in a concentration from 0.8 molar to 1.2 molar and sodium or potassium hydroxide in a concentration from 0.3 molar to 1.5 molar. This etchant rapidly removes the semiconductor material leaving smooth surfaces, while leaving the gold conductors and areas protected by oxide layers essentially intact. The use of titanium layers as etching masks, deposited for example by evaporating or sputtering through a removable mask, is also disclosed.
REFERENCES:
patent: 3674580 (1972-07-01), Erdman
patent: 3716429 (1973-02-01), Sebastian et al.
Bell Telephone Laboratories Incorporated
Friedman A. N.
Indig G. S.
Powell William A.
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