Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1996-01-16
1997-08-05
Angebranndt, Martin
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 52, 216 20, 216 80, 216 65, 216 19, 216 48, 216 49, 216 76, B44C 122
Patent
active
056538928
ABSTRACT:
A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A front side optical coating (e.g. transparent metal layer 44, transparent organic layer 46 and conductive metallic layer 48) is elevated above the substrate between the ceramic islands. This allows additional material (e.g. polyimide 38) between the optical coating and the substrate above the regions where cavities are to be etched. Etching of the cavities (72) is performed from the back side of the substrate without damaging the front side optical coating. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 80) containing a massive array of sensing circuits.
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Belcher James F.
Owen Robert A.
Angebranndt Martin
Carlson Brian A.
Donaldson Richard L.
Kesterson James C.
Texas Instruments Incorporated
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