Etching nitride and anti-reflective coating

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S725000, C257SE21214

Reexamination Certificate

active

07915175

ABSTRACT:
A method of forming a semiconductor structure comprises etching an anti-reflective coating on a substrate with a first plasma comprising bromine and oxygen; and etching a nitride layer on the substrate with a second plasma comprising bromine and oxygen.

REFERENCES:
patent: 4174251 (1979-11-01), Paschke
patent: 4568410 (1986-02-01), Thornquist
patent: 4654114 (1987-03-01), Kadomura
patent: 4808259 (1989-02-01), Jillie, Jr. et al.
patent: 5279705 (1994-01-01), Tanaka
patent: 5639687 (1997-06-01), Roman et al.
patent: 5924000 (1999-07-01), Linliu
patent: 5928967 (1999-07-01), Radens et al.
patent: 5989979 (1999-11-01), Liu et al.
patent: 6130146 (2000-10-01), Chang et al.
patent: 6174590 (2001-01-01), Iyer et al.
patent: 6174644 (2001-01-01), Shieh et al.
patent: 6235456 (2001-05-01), Obok
patent: 6235644 (2001-05-01), Chou
patent: 6296780 (2001-10-01), Yan et al.
patent: 6307174 (2001-10-01), Yang et al.
patent: 6379872 (2002-04-01), Hineman et al.
patent: 6399514 (2002-06-01), Marks et al.
patent: 6423631 (2002-07-01), Iyer et al.
patent: 6428716 (2002-08-01), Demmin et al.
patent: 6436812 (2002-08-01), Lee
patent: 6451703 (2002-09-01), Liu et al.
patent: 6461969 (2002-10-01), Lee et al.
patent: 6699795 (2004-03-01), Schwarz et al.
patent: 6841491 (2005-01-01), Sadoughi et al.
patent: 7112834 (2006-09-01), Schwarz et al.
patent: 2001/0012667 (2001-08-01), Ma et al.
patent: 2002/0006715 (2002-01-01), Chhagan et al.
patent: 2004/0242759 (2004-12-01), Bhave
Encyclopedia of Chemical Technology, Kirk-Othmer, vol. 14, pp. 677-709, (1995).
USPTO Notice of Allowance for U.S. Appl. No. 10/039,469 dated Aug. 26, 2004; 8 pages.
USPTO Non-Final Rejection for U.S. Appl. No. 10/039,469 dated Mar. 11, 2004; 11 pages.
USPTO Non-Final Rejection for U.S. Appl. No. 10/039,469 dated Jun. 16, 2003; 8 pages.
USPTO Notice of Allowance for U.S. Appl. No. 10/791,657 dated Jun. 8, 2006; 6 pages.
USPTO Non-Final Rejection for U.S. Appl. No. 10/791,657 dated Jan. 26, 2006; 5 pages.
USPTO Requirement for Restriction/Election for U.S. Appl. No. 10/791,657 dated Dec. 1, 2005; 4 pages.
USPTO Corrected Notice of Allowance for U.S. Appl. No. 10/099,841 dated Oct. 7, 2003; 6 pages.
USPTO Notice of Allowance for U.S. Appl. No. 10/099,841 dated Oct. 2, 2003; 2 pages.
USPTO Final Rejection for U.S. Appl. No. 10/099,841 dated Apr. 15, 2003; 14 pages.
USPTO Non-Final Rejection for U.S. Appl. No. 10/099,841 dated Nov. 20, 2002; 11 pages.
USPTO Election/Restriction for Requirement for U.S. Appl. No. 10/099,841 dated Jun. 18, 2003; 2 pages.
Wolf et al., “Silicon Processing for the VLSI Era,” vol. 1: Process Technology, 1999, pp. 550-556; 7 pages.
Robert F. Pierret, “Semiconductor Device Fundamentals,” Addison-Wesley, 1996, pp. 525-539 and 149-174; 34 pages.
Peter Van Zant, “Microchip Fabrication: A Practical Guide to Semiconductor Processing,” 2000, 3rd Ed., Chapter 16, pp. 491-527; 39 pages.

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