Etching method, program, computer readable storage medium...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S714000, C438S723000

Reexamination Certificate

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07655570

ABSTRACT:
A difference in etching rate between the coated silicon based insulating film and any of other kinds of silicon-based insulating films is reduced by using nitrogen gas as a part of the etching gas. Therefore, the underlying film may not be exposed to the etching gas for a long time, so that degradation or deterioration of the underlying film can be prevented.

REFERENCES:
patent: 5269879 (1993-12-01), Rhoades et al.
patent: 6258713 (2001-07-01), Yu et al.
patent: 6316351 (2001-11-01), Chen et al.
patent: 6562720 (2003-05-01), Thilderkvist et al.
patent: 6730573 (2004-05-01), Ng et al.
patent: 7018921 (2006-03-01), Ryu
patent: 2001-077086 (2001-03-01), None
patent: 2001-351974 (2001-12-01), None

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