Etching method, etched product formed by the same, and...

Details Etching method, etched product formed by the same, and... Etching method, etched product formed by the same, and...

2005-04-27

2009-02-03

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C438S753000

Reexamination Certificate

active

07485238

ABSTRACT:
In a state in which respective portions of a quartz wafer have been masked by a plurality of kinds of mask layers that have respectively different etching rates, the quartz wafer is subjected to an etching process. Since the etching operation is started earlier at a first portion which is masked by the mask layer having a high etching rate, the amount of etching is increased at the first portion. In contrast, the start of the etching operation is delayed at a second portion which is masked by the mask layer having a low etching rate, and the amount of etching is reduced at the second portion. Thus, it becomes possible to form the quartz wafer into a desired shape.

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