Etching method, a substrate with a plurality of concave...

Details Etching method, a substrate with a plurality of concave... Etching method, a substrate with a plurality of concave...

2008-03-04

2008-03-04

Lee, Diane I. (Department: 2851)

Optical: systems and elements

Miscellaneous

C359S443000, C359S454000, C359S900000, C216S024000, C216S034000, C438S043000

Reexamination Certificate

active

11019994

ABSTRACT:
An etching method is disclosed. The etching method includes the steps of: preparing a substrate5;forming first and second films61, 62each having predetermined internal stress on the substrate so that the internal stresses of the first and second films61, 62are canceled out or reduced with each other; forming a plurality of initial holes63in the first and second films61, 62to form a mask6;and forming a plurality of concave portions3in the substrate5at portions corresponding to the plurality of initial holes63by subjecting the substrate5to an etching process using the mask6.

REFERENCES:
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patent: 6437918 (2002-08-01), Hamanaka et al.
patent: 2003/0219935 (2003-11-01), Miyairi et al.
patent: 2004/0229169 (2004-11-01), Sandstrom
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patent: 2002-198495 (2002-07-01), None
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patent: 2003-224265 (2003-08-01), None
Communication from Japanese Patent Office re: related application, May 12, 2002.

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