Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-04-17
2000-08-22
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
31511121, H05H 100
Patent
active
061066605
ABSTRACT:
An installation for wafer etching that has an additional bias voltage applied to its lower electrode, comprising a central processing unit, a radio frequency generator, a matching box controller, a radio frequency sensor box, a matching box and an etching machine. The central processing unit is connected to the radio frequency generator and the matching box controller for controlling the generation of radio frequency power and the bias voltage provided by the matching box. The radio frequency sensor box receives the radio frequency power and transfers the radio frequency power to the matching box, while a signal is sent to the matching box controller for controlling the bias voltage supplied to the lower electrode. Consequently, the ions can have more kinetic energy resulting in a greater bombarding effect and the formation of polymer on the wafer is limited. Furthermore, the effect of helium loss can be minimized and down time of the etching machine can be greatly reduced. Hence, product stability can be increased as well.
REFERENCES:
patent: 5272417 (1993-12-01), Ohmi
Dang Thi
United Semiconductor Corp.
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