Etching in combination with other processing techniques to...

Details Etching in combination with other processing techniques to... Etching in combination with other processing techniques to...

2005-04-19

2005-04-19

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S022000

Reexamination Certificate

active

06881600

ABSTRACT:
Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.

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patent: 5418190 (1995-05-01), Cholewa et al.
Iscoff, R. “Prime cuts: what users want in singulation tools” Chip Scale magazene Aug.-Sep. 2001. <<http://www.chipscalereview.com/issues/0801/f1_01.html>> viewed Dec. 10, 2004.

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