Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1991-07-22
1992-12-08
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156640, H01L 2100
Patent
active
051694778
ABSTRACT:
An etching apparatus for forming circuit patterns on a printed circuit board comprises a conveyor for conveying printed circuit boards, a solvent pump for pumping etching solution, nozzles for spraying etching liquid or water on the printed circuit board, and a rinsing device for rinsing the surface of the printed circuit board. The discharge pressure of the pump for the etching solvent is preferably in the range 5.about.10 kg/cm.sup.2 and the distance between the nozzles and the printed circuit board is 50.about.200 mm.
REFERENCES:
patent: 4565755 (1986-01-01), Ohtake et al.
patent: 4609575 (1986-09-01), Burkman
patent: 4861422 (1989-08-01), Kudou et al.
patent: 4973379 (1990-11-01), Brock et al.
patent: 4985111 (1991-01-01), Ketelhohm
"Aerosol Jet Etching of Fine Patterns", by Chan et al.; Appl. Phys. Lett. 51(26); 1987; pp. 2203-2205.
Kawakami Shin
Kubo Isamu
Seki Kameharu
Adams Bruce L.
Goudreau George
Hearn Brian E.
Nippon CMK Corp.
Wilks Van C.
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