Etching apparatus and method for manufacturing optical devices

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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C23F 102

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active

060745134

ABSTRACT:
An etching apparatus comprises a first tank for containing an etchant, a second tank for containing a non-etchant, a partition positioned between the first tank and the second tank and consisting of a plurality of partition planes, and holders for holding a plurality of substrates against the partition. One or more openings are formed in each partition plane of the partition, and the substrates are held against the partition so that the openings formed in the partition planes are closed by the substrates. Each substrate is larger than the associated opening in size and has a top surface and an etching surface on the bottom. Each of the holders holds one of the substrates so that the etching surface of the substrate is exposed to the etchant contained in the first tank through the opening without touching the non-etchant and that the top surface of the substrate is exposed to the non-etchant contained in the second tank without touching the etchant. The size and/or the shape of the opening can be adjusted according to the size and/or the shape of the substrate.

REFERENCES:
Palik et al., "Fabrication and Characterization of Si Membranes," J. Electrochem. Soc., Dec. 1988.

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