Etching apparatus and etching system using the method thereof

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118723E, 118712, 118713, C23F 102

Patent

active

061497614

ABSTRACT:
A method for detecting an etching endpoint and a plasma etching apparatus and a plasma etching system using such a device are disclosed, in which time series data of a signal corresponding to the amount of light of the plasma light generated during the plasma etching process are arithmetically processed, so that the change of light amount is corrected and an etching endpoint is detected from the time series data after the correction.

REFERENCES:
patent: 4936867 (1990-06-01), Ikuhara et al.
patent: 4936967 (1990-06-01), Ikuhara et al.
patent: 5118378 (1992-06-01), Moroi et al.
patent: 5236556 (1993-08-01), Yokota et al.
patent: 5290383 (1994-03-01), Koshimizu
patent: 5322590 (1994-06-01), Koshimizu
patent: 5352902 (1994-10-01), Aoki
patent: 5565114 (1996-10-01), Saito et al.
patent: 5626714 (1997-05-01), Miyazaki et al.
patent: 5759424 (1998-06-01), Imatake et al.
patent: 5786886 (1998-07-01), Litvak et al.

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