Etched leadframe structure

Details Etched leadframe structure Etched leadframe structure

2011-04-12

2011-04-12

Le, Thao (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21502

Reexamination Certificate

active

07923301

ABSTRACT:
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.

REFERENCES:
patent: 7045396 (2006-05-01), Crowley et al.
patent: 2006/0151858 (2006-07-01), Ahn et al.

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