Etched interposer for integrated circuit devices

Details Etched interposer for integrated circuit devices Etched interposer for integrated circuit devices

2004-08-23

2008-08-19

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S112000, C438S118000, C438S701000, C438S708000, C257SE21219

Reexamination Certificate

active

07413995

ABSTRACT:
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer106includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

REFERENCES:
patent: 5321583 (1994-06-01), McMahon
patent: 6245594 (2001-06-01), Wu et al.
patent: 6255740 (2001-07-01), Tsuji et al.
patent: 6372620 (2002-04-01), Oosawa et al.
patent: 6451627 (2002-09-01), Coffman
patent: 6469908 (2002-10-01), Patel et al.
patent: 6528874 (2003-03-01), Iijima et al.
patent: 6548328 (2003-04-01), Sakamoto et al.
patent: 6589870 (2003-07-01), Katoh
patent: 6617236 (2003-09-01), Oosawa et al.
patent: 6646337 (2003-11-01), Iijima et al.
patent: 6671947 (2004-01-01), Bohr
patent: 6782610 (2004-08-01), Iijima et al.
patent: 6828221 (2004-12-01), Iijima et al.
patent: 6884709 (2005-04-01), Iijima et al.
patent: 6908792 (2005-06-01), Bruce et al.
patent: 2003/0207492 (2003-11-01), Maeda et al.
patent: 2006/0077644 (2006-04-01), Nickerson et al.
patent: 2007/0001277 (2007-01-01), Ichikawa
Chipsupply.com, “Chip Scale Packaging (CSP)”, [online], [retrieved on Apr. 22, 2004], retrieved from the Internet at <URL:http://www.chipsupply.com.corporate.interconnect%20solutions/chip%20scale.htm>.
IMEC, “Advanced Packaging Technologies to Bridge the Interconnect Technology Gap”, downloaded prior to Aug. 23, 2004, pp. 1-8.
Intel Corporation, “The Chip Scale Package (CSP)”,2000 Packaging Databook, 2000, Ch. 15, pp. 15-1 through 15-16.
IVF- The Swedish Institute of Production Engineering Research, “Chapter B: Flip-Chip Technology”, [online], [retrieved on Aug. 22, 2004], retrieved from the Internet at <URL:http://extra.ivf.se
gl/B-Flip-Chip/ChapterB1.htm>.
Mahajan, R. K. Brown, and V. Atluri, “The Evolution of Microprocessor Packaging”,Intel Technology Journal, Q3, 2000, pp. 1-10.
Mahajan, R. R. Nair, V. Wakharkar, J. Swan, J. Tang, and G. Vandentop, “Emerging Directions for Packaging Technologies”,Intel Technology Journal, vol. 6, Issue 2, May 2002, pp. 62-75.
Dataweek, “Stacked-CSP Delivers Flexibility, Reliability and Space-Saving Capabilities”, [online], Aug. 27, 2004, [Retrieved on Jul. 14, 2004], retrieved from the Internet at <URL: http://dataweek.co.za
ews.asp?pklNewsID=11744&pklIssueID=348&pklCategoryID=36>.
Intel Corporation, “Silicon: Packaging Solutions for a Mobile Marketplace”, [online], 2004, [Retrieved on Jul. 14, 2004], retrieved from the Internet at <http://www.intel.com/research/silicon/mobilepackaging.htm>.
McCormick, A., “Pins & Vias: New Processes, Materials Extend Flexible Circuit Use”, [online], May 2003, [Retrieved on Jul. 14, 2004], retrieved from the Internet at <http:/
easia.nikkeibp.com
ea/200305/manu—244639.html>.
Mallik, D., K. Radhakrishnan, J. He, C. Chiu, T. Kamgaing, D. Searls, & J.D. Jackson, “Advanced Package Technologies for High-Performance Systems,” Intel Technology Journal, vol. 9, Issue 4, Nov. 9, 2005, 16 pp.
North Corporation, “Neo-Manhattan Technology: A Novel HDI Manufacturing Process”, from IPC Flex & Chips Symposium, Feb. 2003, 32 pp.

Affiliated with

Also associated with

Rating

Etched interposer for integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etched interposer for integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etched interposer for integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3999592