Etched article

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156643, 156650, 156651, 156652, 156656, 156657, 204 15, 2041294, 204192E, 204192M, 360122, 360126, C23C 1500, C25F 300, C25F 500

Patent

active

044540140

ABSTRACT:
A method for fabricating a metallic pattern on a substrate is disclosed. The method consists of depositing an adhesive and/or plating base material on a substrate upon which a narrow self-supporting border of photoresist is applied. An anodic layer is then deposited and the photoresist removed. The adhesive and plating base material is etched in those areas previously covered by the photoresist and fresh photoresist applied to encapsulate those areas of the anodic layer which form the final pattern of interest. The unwanted anodic material is then etched and the photoresist removed.

REFERENCES:
patent: 3745094 (1973-07-01), Greene
patent: 3853715 (1974-12-01), Romankin
patent: 3878006 (1975-04-01), Rice
patent: 3878007 (1975-04-01), Feldstein et al.
patent: 3901770 (1975-08-01), Littwin
patent: 4131525 (1978-12-01), Tijburg et al.
patent: 4260450 (1981-04-01), Neu
patent: 4274935 (1981-06-01), Schmelzer
patent: 4315985 (1982-02-01), Castellani et al.
patent: 4369477 (1983-01-01), Hanaoka

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Etched article does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etched article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etched article will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-120327

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.