Etchant, method for roughening copper surface and method for...

Details Etchant, method for roughening copper surface and method for... Etchant, method for roughening copper surface and method for...

2007-03-13

2007-03-13

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

C216S011000, C216S013000

Reexamination Certificate

active

10393874

ABSTRACT:
An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.

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