Etchant for etching metal wiring layers and method for...

Details Etchant for etching metal wiring layers and method for... Etchant for etching metal wiring layers and method for...

2006-03-07

2006-03-07

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S105000

Reexamination Certificate

active

07008548

ABSTRACT:
The present invention discloses an etchant for etching at least two different metal layers, the etchant comprising hydrogen peroxide (H2O2) and one of carboxylic acid, carboxylate salt, and acetyl group (CH3CO—). The present invention also discloses a method of fabricating a metal wiring on a substrate, the method comprising forming a first metal layer on a substrate, forming a second metal layer on the first metal layer, and simultaneously etching the first metal layer and the second metal layer with an etchant comprising hydrogen peroxide (H2O2) and one of carboxylic acid, carboxylate salt, and acetyl group (CH3CO—)

REFERENCES:
patent: 4140772 (1979-02-01), Korenowski
patent: 4345969 (1982-08-01), James et al.
patent: 5298117 (1994-03-01), Hanson et al.
patent: 5773359 (1998-06-01), Mitchell et al.
patent: 6624086 (2003-09-01), Eissa
patent: 07166373 (1995-06-01), None
Full Computer Translation of JP-07166373 A to Murayama.

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