Etch-stop resins

Details Etch-stop resins Etch-stop resins

2005-08-02

2005-08-02

Moore, Margaret G. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

C528S043000, C427S387000, C257SE23167, C257SE21705, C257SE21576, C438S781000, C106S287140, C106S287120

Reexamination Certificate

active

06924346

ABSTRACT:
Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

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patent: WO 01/18861 (2001-03-01), None

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