Etch stop for copper damascene process

Details Etch stop for copper damascene process Etch stop for copper damascene process

1996-07-15

1997-12-02

Niebling, John

Fishing, trapping, and vermin destroying

437195, H01L 2144

Patent

active

056935633

ABSTRACT:
The invention describes the application of copper damascene connectors to a double level metal process. A dual damascene copper connector whose upper surface is coplanar with the upper surface of the insulating layer in which it is embedded is described. Out-diffusion of copper from the connector is prevented by at least two barrier layers. One or two barrier layers are located at the interface between the connector and the insulating layer while another barrier layer comprises conductive material and covers the upper surface of the connector. When a second damascene connector is formed above the first connector the conductive barrier layer facilitates good contact between the two connectors. It also acts as an etch stop layer during the formation of the second connector. A process for manufacturing this structure is also described. It involves over-filling a trench in the surface of the insulator with copper and then removing the excess by chem.-mech. polishing.

REFERENCES:
patent: 4910169 (1990-03-01), Hoshino
patent: 4931410 (1990-06-01), Tokunaga et al.
patent: 5084412 (1992-01-01), Nakasaki
patent: 5141897 (1992-08-01), Manocha
patent: 5354712 (1994-10-01), Ho et al.
patent: 5447599 (1995-09-01), Li et al.
patent: 5447887 (1995-09-01), Filipiak et al.
patent: 5602053 (1997-02-01), Zheng
patent: 5612254 (1997-03-01), Mu
patent: 5635423 (1997-06-01), Huang

Affiliated with

Also associated with

Rating

Etch stop for copper damascene process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etch stop for copper damascene process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etch stop for copper damascene process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-800940