Etch resist using printer technology

Details Etch resist using printer technology Etch resist using printer technology

2005-07-26

2005-07-26

Yan, Ren (Department: 2854)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098300, C427S282000, C216S013000, C216S041000, C101S107000, C101S483000, C101S163000

Reexamination Certificate

active

06921550

ABSTRACT:
The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate into the printer, printing an inverse circuit image on the copper-clad substrate, allowing the inverse circuit image to dry, metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper to form a metalized circuit image, and etching the copper-clad substrate that has been metalized to remove copper that forms the inverse circuit image.

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