Etch-ending point measuring method for wet-etch process

Details Etch-ending point measuring method for wet-etch process Etch-ending point measuring method for wet-etch process

1996-04-16

1998-08-04

Codd, Bernard P.

Etching a substrate: processes

Nongaseous phase etching of substrate

With measuring, testing, or inspecting

216 83, 216 97, 216 99, 438745, C23F 100, C25F 300

Patent

active

057888710

ABSTRACT:
A wet-etching method which determines a desired etch-ended point includes the steps of providing an etchant solution in a bath, performing the wet-etch process by dipping a material to be etched in the bath, measuring a weight variation value of the material during the wet etch process, calculating a thickness variation value of the material by using the weight variation value, and stopping the wet-etch process when the thickness variation value reaches a preset value.

REFERENCES:
patent: 3923567 (1975-12-01), Lawrence
patent: 5329124 (1994-07-01), Yamamoto
Masterton et al., "Chemical Principles with Qualitative Analysis", p. 457, 1978.

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