Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1989-03-08
1995-10-17
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
1566461, B05C 500
Patent
active
054587247
ABSTRACT:
Processing gases in an etching chamber for semiconductor wafers are dispersed by a porous plastic membrane interposed between the source of gases and the wafer being processed. A peripheral outlet in the chamber wall exhausting gases is also traversed by a porous plastic membrane.
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Haak Eugene L.
Novak Richard E.
Syverson Daniel J.
Dang Thi
FSI International Inc.
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