Etch-back apparatus for integrated circuit failure analysis

Details Etch-back apparatus for integrated circuit failure analysis Etch-back apparatus for integrated circuit failure analysis

1988-09-13

1990-10-09

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 20429831, 20419232, H01L 21308

Patent

active

049618121

ABSTRACT:
An apparatus and a method to inhibit sputtering of undesirable material onto a dielectric layer of an integrated circuit being etched. After exposing the integrated circuit within its package, the leads of the integrated circuit are electrically coupled together by a metallic foil. The metallic foil is wrapped about the package to also provide thermal coupling, however, the integrated circuit is left exposed. Then, the integrated circuit is placed onto an etch-resilient plate disposed atop a cathode electrode. An opening in the plate allows direct placement of the integrated circuit onto the cathode. An etch-resilient cover is placed above the plate opening and the integrated circuit, but the cover has an opening to expose the integrated circuit. During etching, the cover inhibits sputtering from the leads, preform and bond wires.

REFERENCES:
patent: 4376692 (1983-03-01), Tsukada
patent: 4661203 (1987-04-01), Smith

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