Esterified resorcinol-carbonyl compound condensates and epoxy re

Details Esterified resorcinol-carbonyl compound condensates and epoxy re Esterified resorcinol-carbonyl compound condensates and epoxy re

1995-08-28

1998-03-10

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

428246, 428261, 428416, 525481, 528128, 528155, C08G 802, C08G 804, C08G 822

Patent

active

057262578

ABSTRACT:
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.

REFERENCES:
patent: 3650799 (1972-03-01), Young, Jr. et al.
patent: 4297457 (1981-10-01), Stark, Jr.
patent: 4334067 (1982-06-01), Ohno et al.
patent: 4387207 (1983-06-01), Edwards
patent: 5182184 (1993-01-01), Lazarus et al.
patent: 5283324 (1994-02-01), Tomioka et al.
patent: 5290657 (1994-03-01), Uetani et al.
patent: 5374742 (1994-12-01), Uetani et al.
patent: 5436107 (1995-07-01), Tomioka et al.
patent: 5556995 (1996-09-01), Suzuki et al.
patent: 5587492 (1996-12-01), Tomioka et al.
Patent Abstracts of Japan, vol. 17, No. 611 (P-1641),, 10 Nov. 1993 & JP 05 188590.
Patent Abstracts of Japan, vol. 17, No. 327 (C-1073), 22 Jun. 1993 & JP 05 032654A.
Patent Abstracts of Japan, vol. 18, No. 558 (C-1264), 25 Oct. 1994 & JP 06 199989A.
Patent Abstracts of Japan, vol. 18, No. 383 (C-1640), 19 Jul. 1994 & JP 06 106676A.
Patent Abstracts of Japan, vol. 18, No. 383 (C-1640), 19 Jul. 1994 & JP 06 106674A.
Chemical Abstracts, vol. 105, No. 5, (4 Aug. 1986), F. Matsunaga et al., "Oxyflavans", p. 712, No. 4254lu, JP 61-27 980 A.
Chemical Abstracts, vol. 119, No. 24 (13 Dec. 1993), K. Hashimoto et al., "Manufacture of Novolak Resin and Positive-working Photoresist Composition", p. 726, No. 259 559e.
Chemical Abstracts, vol. 121, No. 18 (31 Oct. 1994), T. Morimoto et al., "Epoxy Resins and Their Compositions for Potting and Electronic Device Packaging", p. 105, No. 207 371j.

Affiliated with

Also associated with

Rating

Esterified resorcinol-carbonyl compound condensates and epoxy re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Esterified resorcinol-carbonyl compound condensates and epoxy re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Esterified resorcinol-carbonyl compound condensates and epoxy re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-140367