ESD protection for deep submicron CMOS devices with minimum trad

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means

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361111, 257173, 257356, H02H 322, H01L 2362

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active

057197334

ABSTRACT:
Apparatus and process for making the apparatus for electrostatic discharge (ESD) protection of an electronic device, using a silicon controlled rectifier (SCR) configuration. A spaced apart p-well and n-well are formed in a substrate, and spaced apart p+ and n+ contact regions are formed in each well, with an additional n+ or p+ drain tap contiguous to and lying between the two wells. The wells may be formed by a retrograde process or by a conventional process, with or without an epitaxial layer. A first electrode (ground) is connected to the p+ and n+ contact regions and through a polysilicon region to a gate oxide region in the first well. The polysilicon region has a small, controlled poly length. A second electrode is connected to the p+ and n+ contact regions in the second well and to an electrical circuit to be protected against ESD. The second well may be replaced by a portion of the substrate, of opposite electrical polarity to the first well. The triggering voltage for snapback of the SCR device is tunable over a voltage range as low as 5-11 Volts, and the device dynamical resistance in the on-state is about 8-9 Ohms. The SCR device has reduced tradeoff with latchup behavior of the electronic device to be protected.

REFERENCES:
patent: 5140401 (1992-08-01), Ker et al.
patent: 5343053 (1994-08-01), Avery
patent: 5400202 (1995-03-01), Metz et al.
patent: 5430595 (1995-07-01), Wagner et al.

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