Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing
Patent
1992-04-14
1993-08-31
Nimmo, Morris H.
Electricity: conductors and insulators
With fluids or vacuum
With cooling or fluid feeding, circulating or distributing
257714, 361689, 428408, 428698, 428699, H05K 720
Patent
active
052411311
ABSTRACT:
The present invention relates generally to a new erosion/corrosion resistant diaphragm, and more particularly to an erosion/corrosion resistant diaphragm that can be used in an apparatus for cooling integrated circuit chips. An erosion/corrosion resistant coating can be provided on one side of a metallic foil that will be exposed to fluid impingement. And, a similar erosion/corrosion resistant coating can be provided on the opposite side of the metallic foil where the normal thermal cycling of the chip might damage the unprotected metallic foil.
REFERENCES:
patent: 4381032 (1984-04-01), Cutchaw
patent: 4531146 (1985-07-01), Cutchaw
patent: 4612978 (1986-09-01), Cutchaw
patent: 4740866 (1988-04-01), Kajiwara et al.
patent: 4750086 (1988-07-01), Mittal
patent: 4928207 (1990-05-01), Chrysler et al.
patent: 5023690 (1991-06-01), Umezawa et al.
patent: 5031029 (1991-07-01), Acocella et al.
patent: 5097385 (1992-03-01), Chao-Fan Chu et al.
patent: 5166863 (1992-11-01), Shmunis
IBM Technical Disclosure Bulletin, vol. 20, No. 8, p. 3121 Jan. 1978, A. H. Johnson, "Diaphragm Cooling for Devices".
IBM Technical Disclosure Bulletin, vol. 20, No. 10, p. 3919 Mar. 1978, A. H. Johnson, "Device Cooling".
IBM Technical Disclosure Bulletin, vol. 28, No. 1B, pp. 494-495 Jun. 1984, C. D. Ostergren, "Mini Conformal Cold Plate".
IBM Technical Disclosure Bulletin, vol. 28, No. 11, pp. 4759-4761 Apr. 1986, "New TCM Design Using Bellows".
IBM Technical Disclosure Bulletin, vol. 29, No. 7, p. 2887 "Liquid-Cooled Circuit Package With Jet Impinging on Heat Sink Held Against Semiconductor Chip That is Sealed From The Jet".
IBM Journal of Research & Development, vol. 34, No. 6, pp. 849-857 Nov. 1990, "Diamondlike Carbon Films by RF Plasma-Assisted Chemical Vapor Deposition From Acetylene".
International Conference on Metallurgical Coatings and Thin Films, San Diego, Apr. 22, 1991, "Diamond-like carbon as an electrical insulator of copper device for chip cooling".
Bakhru Nanik
Grill Alfred
Hopper Gregory S.
Marotta Egidio
Meyerson Bernard S.
Ahsan Aziz M.
International Business Machines - Corporation
Nimmo Morris H.
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