Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Patent
1990-10-19
1992-12-15
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
269 21, 279 3, B32B 3104
Patent
active
051713985
ABSTRACT:
Disclosed herein is an equipment for sticking a vinyl tape on the backside surface of a wafer prior to the dicing of the wafer. Suction ports for sucking and supporting the peripheral part of the wafer surface is provided in the outer block of a stage for supporting the wafer, a recessed part is formed at the central part of the support stage so as to avoid the contact of the central part of the wafer to the support stage, and concentric ring-shaped projection parts are formed on the bottom surface of the recessed part. The height of the top face of the ring-shaped projection parts is set to be slightly lower than the outer block of the support stage which is the wafer contact part, with minute gaps being kept from the fixed wafer. It is possible to prevent the generation of flexure due to a turning roller at the time of sticking of the tape by introducing high pressure air to the recessed part of the wafer support part and the minute gaps.
REFERENCES:
patent: 3955163 (1976-05-01), Novak
patent: 4603466 (1986-08-01), Morley
patent: 5033538 (1991-07-01), Wagner et al.
NEC Corporation
Osele Mark A.
Simmons David A.
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