Equipment and method for mounting electronic components

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29740, 29741, 29755, 29759, 29832, H05K 330

Patent

active

061017094

ABSTRACT:
An apparatus for mounting electronic components includes a moving rail for moving a substrate back and forth, a plurality of part feeders disposed along a side of the moving rail, a plurality of transfer head guide rails installed in a direction orthogonal to a moving direction of the substrate along the moving rail, and a plurality of transfer heads fitted to each of the transfer head guide rails for picking up, transferring and mounting onto the substrate the electronic components from the part feeders while moving along the transfer head guide rails. In a method of mounting electronic components, the electronic components are picked up from part feeders disposed along a side of the moving rail by a nozzle of the transfer head which moves along the transfer head guide rail disposed orthogonally to the moving rail, transferred and loaded onto a substrate while the substrate is moved along the moving rail. This method of mounting electronic components is characterized by determining an X coordinate position for loading the electronic parts based upon a magnitude of movement of the substrate carried by the moving rail, and by determining a Y coordinate position based upon a magnitude of movement of the transfer head moved along the transfer head guide rail.

REFERENCES:
patent: 5007162 (1991-04-01), Weeber
patent: 5040291 (1991-08-01), Janisiewicz et al.
patent: 5456001 (1995-10-01), Mori et al.
patent: 5491888 (1996-02-01), Sakurai et al.
patent: 5566447 (1996-10-01), Sakurai
patent: 5743005 (1998-04-01), Nakao et al.
patent: 5864944 (1999-02-01), Kashiwagi et al.
patent: 5894657 (1999-04-01), Kanayama et al.

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