Equidistance pick-and-place device for ICs

Details Equidistance pick-and-place device for ICs Equidistance pick-and-place device for ICs

2008-03-19

2010-12-14

Underwood, Donald (Department: 3652)

Handling: hand and hoist-line implements

Utilizing fluid pressure

Frames

C414S752100, C198S460200

Reexamination Certificate

active

07850217

ABSTRACT:
An equidistance pick-and-place device for ICs is disclosed. It comprises a housing, a driving device, a guideway structure, a moving structure, a lazy tongs, a plurality of pick-and-place structures, and a transmission structure. The housing supports the equidistance pick-and-place device. The guideway structure is set on the housing. The moving structure slides on the guideway structure. The pick-and-place structures are set on the moving structure. The free end and the shafts of the lazy tongs are fixed in the moving structure. The transmission structure is connected with the driving device and the moving structure for driving the moving structure. The equidistance pick-and-place device utilizes the lazy tongs to drive the pick-and-place structures moving with equidistance to pick and place a plurality of ICs at a time. Therefore, the present invention can improve the efficiency and reduce cost.

REFERENCES:
patent: 6439631 (2002-08-01), Kress
patent: 2002/0153735 (2002-10-01), Kress
Exhibited publicly, Productronica Nov. 13-16, 2007.

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