Patent
1987-07-06
1988-02-02
Edlow, Martin H.
357 74, H01L 2310, H01L 2330
Patent
active
047231564
ABSTRACT:
An EPROM device includes a hollow cap having a head portion made of a material which passes UV rays therethrough and is installed on a lead frame covering an EPROM chip. An UV ray permeable resin fills at least a gap between the head portion of the hollow cap and a main surface of the EPROM chip. A first insulating resin fills the remaining portion of the interior space of the hollow cap, thereby forming with the UV ray permeable resin a double filling structure filling the interior of the cap.
REFERENCES:
patent: 4494217 (1985-01-01), Suzuki et al.
patent: 4635165 (1987-01-01), Okuaki
Clark S. V.
Edlow Martin H.
OKI Electric Industry Co., Ltd.
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