Epoxy type spherical particulate adhesive and process for prepar

Details Epoxy type spherical particulate adhesive and process for prepar Epoxy type spherical particulate adhesive and process for prepar

1986-09-18

1988-03-22

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528 88, 528104, 528118, 528119, 528120, 528121, 528122, 528123, 528124, 528111, 523466, B05D 118

Patent

active

047329610

ABSTRACT:
A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

REFERENCES:
patent: 3102043 (1963-08-01), Winthrop
patent: 3506598 (1970-04-01), Groff
patent: 4243794 (1981-01-01), White
patent: 4251426 (1981-02-01), McClure
patent: 4269760 (1981-05-01), Wakimoto
patent: 4588617 (1986-05-01), Oka

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